The MatriX X2.5# is an automated inspection system designed for sophisticated high-speed inspection in SMT production. Transmission X-ray Technology with patented Slice-Filter-Technique (SFT) and Off-Axis techno-logy present a reliable solution for the in-line inspection of double-sided PCB assemblies. The X2.5# movable detector axes allow high-speed off-axis image acquisition from different angles and directions with maximum image quality and resolution.

X-ray System Features

? Flexible Inline AXI system
? Maintenance free sealed X-Ray tube and digital detector technology
? Automatic grey-level and geometrical calibration
? 5-axes programmable motion system for high speed inspection
? Inline pass through board handling with automatic width adjustment
? Full product traceability via customized MES-Interface
? Optional: Barcode scanner (1D/2D)

APPLICATIONS

ELECTRONIC COMPONENTS AND SOLDER-JOINT
A unique advanced algorithm library is available for electronic applications specifically for component and solder-joint inspection on PCB, hybrid or chip level assembly processes.

? All standard SMD and THT/PTH components
? Specific BGA and QFN algorithm
? Off-axis analysis of BGA Head-in-pillow
? PTH/THT barrel fill measurement

SPECIFICATIONS

Physical Dimension
Dimensions：1670 mm (H) x 3100 mm (W) x 1760 mm (D)
Adjustable conveyor height (SMEMA)：890 – 980 mm
Weight： 3000 kg
Safe Operating Temperature：15° - 32 °C，optimal 20°- 25°C
Power Consumption：max. 6 kW
Line Voltage： 400 VAC, 50/60 Hz 3 phase, 16 A 208 VAC, 50/60 Hz 3 phase, 25 A
Air： 5-7 Bar, < 2 l/min, filtered (30μ), dry, oil free

Motion System
High-speed sample table
Driving distance X,Y： 510 x 410 mm
X-Ray tube (Z)： 0 - 150 mm
Detector Axes (U,V)：220 x 200 mm

X-ray Source (sealed tube)
Energy ：130 kV/40 W
Focal Spot Size ： 5 - 7 microns
X-Ray Tube Orientation： End window tube

Digital Image Detector
Grey value resolution：14 bit
Video output ：Camera link interface
Detector Type A ： CMOS Detector (1,5 k x 1,5 k)
Active inspection area ： 115 x 115 mm
Detector Type B ：CMOS Detector (2 k x 2 k)
Active inspection area： 48 x 48 mm

Image Performance
Angle shot capability：0 – 45 dgr

High-resolution setup
Transmission FoV ： 0.4” (10 mm) to 1.2” (30 mm)
Object resolution (@min. FOV)：3-5 μm

Sample Inspection Parameter
Max. board size： 20”x 16” (510 x 410 mm)
Min. board size： 4” x 3” (100 x 80 mm)
Max. inspection area：19”x 16” (480 x 410 mm )
Max board weight： 11 lbs (5 kg)
Board thickness： 0.03” – 0.2” (0,8 – 5 mm)

Assembly Clearance
Topside (incl. board thickness)： 30 mm
Bottom side (excl. board thickness)： 50 mm
Edge clearance for clamping ： 3 mm

Safety / Regulatory
Full safe, interlocked enclosure. Complies with all U.S. and
International standards for cabinet radiography systems. CDRH
directives / CE compliant.