Bonding Methode
Bond head capability
Speed
Gold wire diameter
Aluminium wire diameter
Ultrasonic system
Utrasonic power
Bond time
Bond force
Bonding tool
Wire spool size
Clamp Design
Wire termination
Clamp movement
Ball size control
Dual camera
Z-Drive & Resolution
Motorized Z travel
X-Y Drive & Resolution
Motorized X &Y travel
Max. component width
X-Y-Z Axis control
Screen size
Software environment
Heater Stage
Temperature controller
Electrical Requirements
Machine Size
Physical Dimensions
Weight
Industry Standards

Wedge-Wedge, Ball-Wedge & Ribbon-bonding
One head for Wedge & Ball bonding, only tool change required
1 Wire in 3 sec
17-75u (0.7-3 mil)
17-75u (0.7-3 mil)
63.3 kHz Transducer PLL Control (110kHz option)
0-10 Watt
0-5 sec.
10 - 200 cNm
1,58 ? 19 mm length (0,0624” x 0,750")
2"
Deep Access 90° wire feed angle, 14mm immersion depth
Bond Head Tear / CLamp Tear
Motorized, Up / Down
Negative EFO, Software controlled
Detail View & Overview at the same time / 150 times magnification
Lead Screw Motor / 0,5um
100mm (3.9")
Linear motors / 0,1 um
90 mm (3,5")
400 mm (15,7")
Joystick
21" Touchscreen
Industrial PC with Windows 7
90mm ? surface / mechanical & vacuum clamping (other sizes available)
up to 200°C +/- 1°C
100 - 240V +/-10% 50/60 Hz 10A max.
Desktop Design for quick installation and easy portability
620 (24.4") x 750 (29.5") x 680mm (26.7")
Net 72 kg
CE standards